Intel® 32nm Logic Technology

Intel's latest silicon process, 32nm logic technology is a revolutionary technical breakthrough, now in full volume production. Incorporating second generation high-k metal gate transistors it features record NMOS and PMOS transistor performance as measured by drive current. It also has the highest reported density of any 32nm or 28nm technology available today as measured by both SRAM array density and gate pitch.

Intel has also developed a full-featured system-on-a-chip (SoC) 32nm process technology to complement our CPU-specific technology. Including ultra-low power transistors with low standby/always-on circuit applications and high voltage I/O transistors, this new SoC technology enables computing devices to be more capable and energy efficient, while enabling smaller, more robust devices. As part of the evolution of Intel's tick-tock model, we will continue to develop a SoC process alongside each logic process.

Moore's Law and the future

Intel's 32nm process continues to deliver the promise of Moore's Law while continuing to transform the way we live, work, and communicate. And with breakthrough 32nm logic technology, you can expect faster processing speeds, greater computing capability, improved functionality, and more sophisticated applications.

While others are not scheduled to deliver on this technology until much later, our 32nm microprocessors are in full production and will be made available in early 2010.

• White paper: Introduction to Intel's 32nm Process Technology

  File Type/Size:  PDF 140KB

• Fact sheet: New Details on Intel's Upcoming 32nm Logic Technology

  File Type/Size:  PDF 127KB

Industry papers and presentations

Intel disclosed numerous technical details about its 32nm process at the International Electron Devices Meeting (IEDM). For more on 32nm technologies from Intel, review the following whitepapers and presentations:

• 2009 32nm
• 2009 32nm SoC
• 2008 32nm
• 2008 Presentation

  File Type/Size:  PDF 932KB